Marquis Top Science, Technology and Engineering Professionals

John Stephen Werner, PE

Title: Electromagnetic Compatibility Engineer
Company: IBM
Location: Fishkill, New York, United States

John Stephen Werner, PE, Electromagnetic Compatibility Engineer at IBM, has been recognized by Marquis Who’s Who Top Engineers for dedication, achievements, and leadership in electrical and electronic engineering.

With many years of experience to his credit, Mr. Werner has excelled as an electromagnetic compatibility engineer with IBM since 2010. Prior to this position, he was active as an associate with Toys ‘R’ Us between 2004 and 2010. Over the course of his academic efforts, he served in a number of appointments at the State University of New York at New Paltz, including as an assistant in microwave circuits, a test engineer, an intern, a teacher’s assistant in electromagnetics and a teacher’s assistant in electronics. In addition to his primary responsibilities, Mr. Werner has contributed to Ithaca College as an advisor to the board of the Cybersecurity Program.

To support his professional ambitions, Mr. Werner pursued an education at the State University of New York at New Paltz, from which he earned a Bachelor of Science in electrical engineering in 2009 before graduating with a Master of Science in electrical engineering in 2010. Among the highlights of his career, he is incredibly proud to have obtained more than 125 patents, including those for “Optimized Route Planning for Multiple Travelers With the Same Destination,” “Adjustable Attenuation Wrap Plug” and “Retractable EMC Protection” in 2023. He was likewise presented with a number of accolades from IBM between 2015 and 2020, including the First Patent Application Achievement Award, the Eminence and Excellence Award, a Manager’s Choice Award, the Invention Development Team (IDT) Award, the Outstanding Innovation Award, and the 32nd Invention Plateau Award, to name a few. Mr. Werner attributes his success to his hunger for knowledge as well as his creative mind.

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