Title: Director of Process Engineering
Company: Applied Materials
Location: San Jose, California, United States
Hsien-Lung Yang, Director of Process Engineering at Applied Materials, has been recognized by Marquis Who’s Who Top Engineers for dedication, achievements and leadership in the Engineering Industry.
Mr. Yang has established a distinguished career in the semiconductor industry, marked by more than two decades of technical leadership and innovation. Since 2023, he has served as the director of process engineering at Applied Materials in Santa Clara, California. In this capacity, Mr. Yang is responsible for the development and oversight of new physical vapor deposition products, specifically for copper barrier and seed applications in back-end-of-line processes. His work supports major global clients, including Taiwan Semiconductor Manufacturing Company, Intel and Samsung Electronics, across advanced technology nodes such as A14, A10, 1282 and SF 1.4/1.0.
Before being acquired by Applied Materials, Mr. Yang was the senior manager of key account technology at ASM in Phoenix, Arizona, from April to July 2023. He led the development of metal thermal atomic layer deposition processes for Taiwan Semiconductor Manufacturing Company by collaborating with corporate research and development, key product units, and global product market teams at headquarters. Mr. Yang’s responsibilities included supporting demonstration projects and resolving startup issues for new application tools.
From 2022 to 2023, Mr. Yang was a senior manager of regional process support engineering east at ASM in Hsinchu, Taiwan. He managed a global customer support team focused on eastern clients and worked closely with internal research and development teams to deliver solutions for customers, such as Taiwan Semiconductor Manufacturing Company and Micron Technology. Notably, Mr. Yang led the successful startup of the first plasma-enhanced atomic layer deposition silicon oxide tool at Micron Singapore, achieving performance targets for three-dimensional NAND applications and earning special recognition from the Micron account team.
Mr. Yang excelled as the director of process and application engineering at Wonik IPS Co. Ltd. in Hsinchu between 2018 and 2019. He played a pivotal role in expanding the company’s presence in the Taiwan market through technical presentations and customer demonstrations with leading research and development groups at Taiwan Semiconductor Manufacturing Company and Winbond Electronics Corporation. Mr. Yang’s efforts resulted in the successful demonstration of plasma-enhanced chemical vapor deposition silicon oxide films that met stringent requirements for backend packaging applications.
Among other influential roles, Mr. Yang served as a senior manager at Yangtze Memory Technologies in Wuhan, Hubei, China, a division head at Wavetek Microelectronics Corporation, and a technical manager at Taiwan Semiconductor Manufacturing Company in Hsinchu City. His professional journey began at Applied Materials, where he spent 2002 to 2014 as a product development engineer, key account technologist and business manager.
Mr. Yang’s academic background includes a Bachelor of Science in computer science and information engineering from National Taiwan University in 1997, followed by coursework in electrical engineering at Cornell University in Ithaca, New York, in 2000, before acquiring a Master of Science in electrical engineering and computer science on campus in 2001. This rigorous education provided a strong foundation for his technical achievements and leadership roles within the semiconductor sector.
Throughout his tenure, Mr. Yang’s most notable accomplishments have included inventing and developing hundreds of chip manufacturing processes for Apple phones, as well as pioneering both hardware and process innovations in physical vapor deposition, chemical vapor deposition, and plasma etching technologies. Mr. Yang’s expertise has been further recognized by several patents granted between 2006 and 2024. His efforts have been documented in scholarly literature as the author of ‘Off-Angular Deposition Compensation for PVD Selective Re-sputtering Process,’ published in Materials Research Society Proceedings in 2008.
Mr. Yang has sought to be recognized as a highly technical individual whose name is synonymous with significant contributions to semiconductor technology and innovation. He takes pride in the expertise he has cultivated and the lasting impact he continues to make through his work. Looking toward the future, Mr. Yang remains dedicated to advancing technological innovation within his field. He also aims to further advance his career within the industry with aspirations toward executive leadership roles, such as vice president within his organization.
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